The invention relates to the manufacture of a semiconductor device which is suitable for surface mounting of a semiconductor body provided with connection regions for, for example, a diode. For example, in accordance with an embodiment of the present invention, an integrated circuit includes a substrate, a first trench in the substrate, and a second trench in the substrate. A request is made for establishment by the second client of a connection of the identified type within the SSLVPN connection. The ink cartridge assembly also includes a cover member including a first portion configured to engage the body, and a second portion. This device will reduce the dead time between the passage of the analyte through the membrane and the detection of said analyte at the sensor.