A semiconductor device includes a plurality of insulating layers laminated on a substrate to cover passive elements such as a capacitor, an inductor, and the like, and to fix an IC chip in a face up state in one of the insulating layers. The side-impact airbag includes a plurality of chambers partitioned in the airbag, a communication passageway formed in a front region of the airbag in a front-and-back direction of the vehicle, and a tether disposed between two of the plurality of chambers located at a rear region of the airbag in the front-and-back direction. The vapor chamber thermally contacts with the processors. In addition, wings may extend from the shank. The layers of fine and coarse fibrous material each have respective different acoustic impedances.