A semiconductor device, a method of manufacturing semiconductor devices and a circuit package assembly are described. Further, the method includes depositing a conductive structure layer onto the silicon substrate, the conductive structure layer making physical contact with at least a portion of the silicon substrate. The brush element has the same cross-sectional area in the third region as in the second region. The USB and IEEE 1394 interfaces are connected to the memory unit via the micro controller for controlling data access. The resolving aperture has a size and shape according to a selected mass resolution and a beam envelope of the ion beam.