A conductive interconnect including trenches and and vias are formed in a workpiece by applying a dielectric film stack over the workpiece, and thereafter applying photoresist over the film stack. The superabrasive wire saw includes a core wire, a bonding material surrounding a surface of the core wire, and a plurality of superabrasive grains bonded to the surface of the core wire with the bonding material. The glyphs present upon startup or synchronization of the electronic device may be determined by scanning the system.