A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. When the flow rate of the coolant is below a threshold the temperature sensor measures the coil temperature. Both features offer advantages relative to prior-art designs. Heat is transferred from the heating liquid to the toner, thereby raising a temperature of the toner to a level above the toner glass transition temperature. Electrical interconnections for the light source and the detector are accessible from the same surface of the substrate with the optics block attached thereto. Further, models formed during the process, as well as the resultant jewelry items, are provided.