A method for fabricating inter-metal oxide in semiconductor devices and semiconductor devices is provided. A support stand is selected for attachment to at least one of the wheel studs of the vehicle for supporting the vehicle on a surface and replacing each of the plurality of wheels with a support stand. A package is arranged to prevent access to the integrated circuit and having magnetic particles therein. The hose comprises at least one layer of thermoplastic material and a rubber bush having a tubular portion housed inside the end portion and suited to be connected by means of a clamp to a fixing portion having a cylindrical portion and a conical end ridge .