A head assembly for presenting a three layer material flow includes primary and secondary housings for presenting a first interior layer and a second intermediate layer of the three layer flow. The UV-transparent glass tube has an indentation extending into the interior space on at least one location and in the at least one indentation at least one UV-light source is arranged. The fault management system processes the fault related data to identify faults in the system, such as when a first of the processing modules is a cause of fault-related data acquired in a second of the processing modules. The compositions effectively remove the photoresist andor post-etch residue material from the microelectronic device without substantially over-etching the underlying silicon-containing layer and metallic interconnect materials. In the printer, when the received print data is bitmap data, information on the bitmap data is registered in a packet structure, and is then set in a development buffer.