A packaging machine for packaging a product. In a single plasma sputter reactor, a first step sputters the wafer rather than the target with high energy ions to remove the barrier layer from the bottom of the via but not from the sidewalls and a second step sputter deposits a second barrier layer, for example of TaTaN, onto the via bottom and sidewalls. The dryer contains a heat source in thermal communication with the dryer. The dummy gate stack is removed to form a gate trench.