A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The holes include two separate circular bolt hole patterns L1 and L2. To protect the inside of the outer component off the collar from abrasions caused by friction against the edges of the metallic insert, the ends of the metallic insert are curved, and a second patch of material is positioned against the curved metal end. The largely rectangular evaluation areas of the photodiode are aligned obliquely in relation to the edges of the conveyed printing material. The vibration electrode plate 112 is held in the silicon substrate 32 by a holding portion 112 placed between the etching holes 36.