A semiconductor wafer saw for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. A search request is received indicating that a requesting node originating the search request desires to avoid receiving search results including inaccessible nodes. The dark pixel array generates analog black reference signals for analog black level calibration of the analog image signals. The processor controls the communication transponder such that information is passed between the wearable electronic device and the further electronic device according to a predetermined operation mode involving interaction of the wearable and further electronic devices.