A method of fabricating a CMOS image sensor is disclosed that enhances device robustness. The method comprises providing a ceramic spray forming pattern, heating the spray forming pattern to a sustained temperature sufficient to prevent internal stress formation in deposited carbon steel having a carbon content of less than about 0. A rear side of the substrate proper is removed until protruded portions of penetration electrodes are exposed, thereby to form a semiconductor substrate. The first and third lens groups move toward the object side. Multiple products may safely be collected in each cycle.