A package for a semiconductor device is formed by a process which includes forming a metal layer in contact with a connection pad on the front side of a semiconductor die while the die is still a part of a wafer. The adjustable element is configured to offset a signal in accordance with an offset control signal and output an offset signal. Location errors and rotation errors of the two light emitting chips with respect to the grating element may be corrected while monitoring the laser beams transmitted through the grating element.