A process for the double-side polishing of semiconductor wafers between two polishing plates which rotate in opposite directions and are covered with polishing cloth, so that at least 2 m of semiconductor material is removed. When a calling party attempts to contact the called party by calling the main number, but cannot reach the main number, a Service Switching Point fires a trigger. Such plasticizers can be employed in preparing polymeric compositions comprising a polymeric resin, such as polyvinyl chloride, and the plasticizer. The present invention proposes to arrange an adjusting layer between two layers of high-k dielectric layer, which effectively avoids reaction of the adjusting layer with the metal gate because of their direct contact, so as to maintain the performance of semiconductor devices.