A chip package having a lead frame, a chip, a plurality of bonding wires, and an insulation material is provided. The adjustment arrangement includes a hanger bracket that has a pair of substantially parallel, spaced apart hanger legs projecting generally away from the vehicle and each of the hanger legs has an elongate aperture or slot that is mutually aligned, one with the other. A glass holding member holds the glass. A first beam handling unit is arranged near the nozzle opening and may convert primary beam into a secondary wide-band heat beam, and then may emit this secondary beam towards a sensor; or may reflectscatter at least a portion of the primary beam towards sensor.