An integrated circuit is provided with diagnostic circuitry, such as serial scan chains or debug bus access circuits, with which communication is established using an interface circuit coupled with a bi-directional serial link to an external diagnostic device. The first wick member includes a first slot. The source wire extends from the source electrode. A patterned hardmask is formed on the copper layer. Additionally, by making the separation pad and the low friction member with the same thickness, when arranged in the concave portion, the surface of the low friction member is formed higher than the surface of the separation pad by the height of the gap formation portion.