In one embodiment, provided is a semiconductor device including a first semiconductor package, a second semiconductor package and a conductive plate. The semiconductor device may include one or more memory blocks and a controller. As a means to indirectly monitor this decrease amount, the valve travel of an APC valve 130 is monitored, and the decreased ashing gas is estimated, and the ashing gas is supplied. Method steps are provided for forming the self-squaring container using the innovative features.