A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A complex solid cone spray can be obtained in this way, which spray has a superior dispersion characteristic obtained by attracting small diameter droplets, which are generated at an outer peripheral portion of the spray, through a spray portion which is generated in the vicinity of a central area of the spray and has a large velocity. In another embodiment, the layer itself may be applied as a liquid film, using extrusion techniques. The motion converting mechanism is a mechanism for converting rotary motion to linear motion and for applying an operating force to the clutch. The interrupted job is stored and is resumed intact after the interrupting job has processed.