In accordance with embodiments, there are provided mechanisms and methods for controlling a process using a process map. By utilizing a fastening device constructed of a flexible, stretchable or elastic material, an electronic device may be wrapped and secured in order to provide protection and prevent damage from impact. Data from the first operation is stored in the FIFO queue, which signals an indication to the second operation that there is data in the queue. Further, one semiconductor device assembly method is provided which removes die from a singular waffle pack device, places die from the single waffle pack device on a semiconductor package to assemble from the placed die all die components required for an integrated circuit, and electrically interconnects the placed die in the semiconductor package to form the integrated circuit.