Disclosed are cup assemblies for holding, sealing, and providing electrical power to a semiconductor substrate during electroplating which may include a cup bottom element having a main body portion and a moment arm, an elastomeric sealing element disposed on the moment arm, and an electrical contact element disposed on the elastomeric sealing element. The protective element includes an elastic member firmly adhered through a solder to second conductor layers and current-carrying electrode terminals formed on a prescribed substrate in such a manner to divide a current-carrying path in plural to form an electric current interruption portion. The solid line accompanied by the dotted line, i.