An electrical interconnection for a highly integrated semiconductor device includes a first insulation layer having at least a first recessed portion on a substrate. The first holding unit includes: a transparent front plate that is fixed onto the display surface; and a frame that holds the front plate from the rear surface side, and the display panel fixed onto the front plate is held by the front plate that is held by the frame. The host process hosts a workflow foundation runtime engine for executing workflows and a workflow foundation library.