A cutting device has a jacket member embodied to selectively shield or expose a rotor commutator, and a cutting mechanism fixed to the jacket member having scissors with a scissor drive. 5 and a collision velocity of between 1. The substrate stage is configured to position a substrate to receive an exposure beam from an exposure portion of a lithography system. The pivotable member is disposed on the carrier through two pivot axle as a pivot point to relatively pivot on the carrier.