A method of fabricating an electronic assembly includes fabricating first and second interconnects. The thin-film capacitor includes a substrate, a capacitor unit disposed above the substrate and composed of at least one dielectric thin film and two electrode layers, a protective layer covering at least part of the capacitor unit, a lead conductor electrically connected to one of the electrode layers of the capacitor unit, and a bump disposed above the lead conductor. Also disclosed are related compositions, including recombinant nucleic acids, vectors, and host cells, which are useful, e. The mooring line is releasably secured to the deployment line substantially along the length of the mooring line.