A technique with which die bonding can be carried out without forming a void in a bond area is provided. The integrated input module has a packaged pump laser diode mounted to the metal EDFA package to provide a heat sink for the pump laser diode which sends the pump laser light over a optical fiber section connected to the amplifying erbium-doped optical fiber section. Due to the non-shared accessing between server units, it represents a more efficient model for computing in terms of the resources usages.