Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The fastening assembly includes a first engaging member, a reciprocating member and a second engaging member. The arrangement is such that the item record is updated so as to include information indicative of the event in which the item has been used when the item has been detected by the detecting means. The reflective layer configured to support and electrically couple to a first electrode of the LED is disposed in the opening. Intermediate race results are received for each intermediate point identifying the actual positions of the particular race participants at that intermediate point.