Interconnecting substrates used in the manufacturing of microelectronic devices and printed circuit assemblies, packaged microelectronic devices having interconnecting substrates, and methods of making and using such interconnecting substrates. The flexible sign includes a carrier with a pressure-sensitive adhesive applied to one side for adhesion to a substrate and indicia provided on the other side. The electrode comprises a first portion having a first thermal coefficient of resistivity and a second portion having a different second thermal coefficient of resistivity. The dual bus approach provides constant communications among the modules and low-capacity data transfer with the option to activate the high-power circuits or tasks only as needed.