Apparatus for processing semiconductor wafers includes a processing chamber, a chuck within the chamber for supporting a wafer during processing, a fiberoptic cable having a first end positioned at the surface of the chuck, and an optical pyrometer connected to a second end of the cable. Specifically, the method of the present invention comprising a step of physically contacting a semiconductor surface having a layer of a dopantbandgap source material thereon such that upon said physical contact impurity atoms from the dopantbandgap source material are driven into the semiconductor substrate. The judge module receives the output data and write-in data and generates write-in control data according to the output data and the write-in data. A third encryption processing portion decrypts the encrypted content data read from memory card with the license key to reproduce content data.