A method of fabricating a semiconductor device structure, includes: providing a substrate, providing an electrode on the substrate, forming a recess in the electrode, the recess having an opening, disposing a small grain semiconductor material within the recess, covering the opening to contain the small grain semiconductor material, within the recess, and then annealing the resultant structure. The master disks can be optically transparent or semi-transparent. The recessed groove forms, by cutting, a ridge portion of an internal thread corresponding to the shape of the recessed groove at the inner peripheral surface of a nut.