Two pieces of semiconductor wafers 101 and 102 to be stacked and fused together are secured to wafer holders 201 and 202 respectively, and are then integrally held at a wafer hold unit 2. The instrument is configured to generate a shock wave, which is then transferred to the distal end of the probe or impactor, and thence into the orthopedic implant, thereby causing the implant to be driven into contact with portions of the void or hole. The methods may also be adapted to operate in a more aggressive mode to further reduce the SNP set while maintaining diversity of haplotype blocks with minimal loss of information.