An electronic device includes a die further having a first major surface, and a second major surface. The camera module includes a composite printed circuit board, an image sensing chip and an underfill. The amplitudes of load currents in the remaining sections of the power lines system are measured before a fault occurs. From compounds of the general formula II, such as 3-O-aryl-4-C-hydroxymethyl-1,2-O-isopropylidene–D-ribofuranose, intermediates of the general formula III are suitable for coupling with silylated nucleobases. These transformed frame data are combined by an image combining unit 25, to obtain image data corresponding the monitoring range free from any gap. At least one offset driven part is detachably attachable to an input part for accessing a fastener for driving thereof.