To improve electronic part packaging efficiency without sacrificing the transmission distance of a radio IC tag, a recess is formed in the front side surface of a printed wiring board. The methods involve screen printing or rotogravure printing a relatively low gloss primer onto portions of a substrate surface covering. The method may further include performing, using a processor-based structural component analyzer, a strength analysis of the structural component using the analysis template and based on the load case and the entry for the analysis variable.