A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. The interposed stent is formed from an elongate wire helically wound with a plurality of longitudinally spaced turns into an open configuration. A process of verifying whether the pieces of software together constitute a software package that requires protection from tampering is also provided. The safety catch can be adjusted between a blocking position engaging over the coupling body and a pulled-back release position.