Systems and methods for improving timing closure of new and existing IC chips by breaking at least one parameter of interest into two or more partial parameters. Consequently, it is possible to remove the adhering material readily by subsequently wiping the nozzle surface with the wiping member, and hence the physical effects can also be improved. Before a copper anti-diffusion insulating film is formed on the entire structure, a specific metal element is doped into the surface of the copper wiring and the surface of its surrounding insulating film to form a metal element-doping layer.