There is provided an underlayer coating causing no intermixing with photoresist layer and having a high dry etching rate compared with photoresist, which is used in lithography process of manufacture of semiconductor device. The compounds are amide compounds which can be prepared from certain heteroaryl carboxylic acids and certain diazabicycloalkanes. The authentication server can rely upon the use of private URLs associated with each user as part of the verification process and can reject users who connect by clicking on a hyperlink directed to the authentication server.