A valve for the control of a fluid flow, with a connection block having a cylinder-symmetrical recess, wherein at least one first and a second entry channel as well as a first and a second exit channel run out in the peripheral surface of the recess. The cooling system includes: a thermal shield unit for thermally shielding a superconducting coil; a recondensing unit for recondensing an extremely low temperature refrigerant that cools down the superconducting coil. The process solution flowing back from the substrate is led off through connecting passages onto the rear face of the flow distributor body. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. In the opened state, the gripper finger is located below a path described by the upper edge of the gripper pad. In preferred embodiments of the invention, a plurality of bondwires couple a plurality of bond pads of the semiconductor chip to the proximal end of a single leadfinger, with assured clearance between the proximal end of the leadfinger and an underlying surface.