A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The method includes maintaining at a node a first timer for a channel which, if set, prevents the node from authorizing a transmission on the channel to itself and maintaining at the node a second timer for the channel which, if set, prevents the node from transmitting on the channel. The transmission and the hose fixing jig are mounted on two sides of the base respectively. The nanotube can be designed having different indices on either side of a junction point in a continuous tube so that the electrical properties on either side of the junction vary in a useful fashion.