For a package structure of chip and the formation thereof, adhesive, conductive and metal layers are positioned on a substrate. The method includes injecting first and second solutions into the micro-channel structure to form at least three liquid film columns, where the first and second solutions include different solvent composition ratios and the liquid columns each, respectfully, include different solvent composition ratios. The outer blade is configured so that the hair inlets are juxtaposed by changing the circumferential distance in a predetermined circumferential area on the annular shaving surfaces.