An image sensor module includes a first substrate, a second substrate provided over the first substrate, an image sensor device for receiving an image signal flip-chip bonded to the second substrate, and a semiconductor device for processing the image signal from the image sensor device embedded in the first substrate. The golf ball has a cover layer with a volume less than 0. In a presently preferred embodiment, an array of dimples is formed during manufacture of the bi-layer laminate by isostatically pressing an array of steel balls against the laminate before firing thereof.