A semiconductor package assembly and method for electrically isolating modules, having a capacitor within the semiconductor package assembly. The method also includes specifying an event data collection rule for the first child template and configuring parent data collection rules for the parent templates accordingly. As a result, a remote copy system with high reliability is obtained. Consequently the first order diffraction pattern from the second set of superimposed gratings can be distinguished from the first order diffraction pattern from the first set of superimposed gratings. The clamp circuit clamps a potential of the control terminal to a level enough to drive the semiconductor element when the one of the transistors is turned on. The inductors filter the current output from the bridge circuits prior to feeding the current into the transformers.