A method and apparatus for forming a multiple semiconductor die assembly having a thin profile are presented. A movable contact holder holds a movable contact and is supported on the switch base via a second pivotal shaft substantially parallel with the first pivotal shaft. The average value of the thickness of a reference flange that receives the tape edge of the magnetic tape during tape winding is set greater than the average value of the thickness of the opposite flange. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability. The packet is not copied even if a copy rule is triggered. The latter provides closure means for closing at least one nozzle of the first stage of the turbine, the said nozzles facing a final section of a feed pipe of the said turbine.