A receptacle includes a container having a bottom wall and a side wall extending from the bottom wall. The diffusion path is provided by forming a contact in which the upper section overlaps the lower section, thus creating a gap that serve as a hydrogen diffusion path. or lower; stacking a build-up insulation layer over the core board; forming an opening by removing a portion of the build-up insulation layer such that the pad is exposed to the exterior; and placing a semiconductor chip in the opening and electrically connecting the semiconductor chip with the pad. Initially, a high column buffer gain is selected. In this case, since the first UBM is formed to be broader than the bottom area of the bump, the adhesion supporting force of the bump at the first UBM is increased, and consequently, the adhesion of the bump with the electrode pad through the first UBM can be improved.