According to one embodiment of the present invention, a semiconductor device includes a first layer of dielectric material disposed upon an upper surface of a substrate of a semiconductor device and a first non-conductive layer of metal disposed upon an upper surface of the dielectric material. The compositions are useful for stabilizing the defined protein components in the presence of fiber, optionally at low pH. Another pipeline padding machine includes a material escalator assembly for elevating material, and a material conditioning assembly for conditioning the material. In one embodiment, IP packets have label values in a first range and MAC packets have label values in a second range.