The applicants have recognized an alternate method of performing modular reduction that admits precomputation. The contact sub-assembly includes a printed circuit and an array of mating contacts. The digital driving circuitry includes a code comparator, a sourcing unit, and a sinking unit. Alternatively, the sacrificial layer is removed by cooling the sandwich with liquid nitrogen, or alternatively still, the sacrificial layer is removed by heating the sacrificial layer, thereby evaporating the sacrificial layer.