The present invention provides grasping mechanisms, gripper apparatussystems, and related methods. The committing logic is configured to receive a loan commitment from a lender. The substrate opens into the outflow region as an outflow cavity. The feedback circuit connected to the output node of the first buffer may be configured to control the amplification signal. The wafers are then cooled and removed from the atmospheric batch furnace. This erasure radiation can have both a first and a second intensity, the first intensity being larger than the second intensity.