A bond magnet according to the present invention is anisotropic, and a magnetic field is oriented from a lowest edge of side surface of the bond magnet toward an upper section of side surface of the bond magnet. In an example, a method of dicing a wafer having a plurality of integrated circuits thereon involves dicing the wafer into a plurality of singulated dies disposed above a dicing tape. 99 mol % and having a specific amount of an ionic group bonded to the terminal thereof via a sulfido bond.