According to the invention, there is provided seed and plants of the corn variety designated CV808014. The semiconductor structure has a first and a second doped region and a buried channel between the first and the second doped region, wherein the buried channel has a first length along the first direction. An initial injection distribution ratio is set based on an engine condition at a time of start of the engine, and a change in the injection distribution ratio is controlled by referring to the engine condition after the start of the engine, when the injection distribution ratio is changed from the initial injection distribution ratio to the target injection distribution ratio. The plurality of front electrodes respectively have areas that overlap with areas of the conductive adhesive film, and the areas of the respective plurality of front electrodes are also in contact with the areas of the conductive adhesive film.