A wafer-level chip-scale package includes a semiconductor die having planar top and bottom surfaces and a plurality of metal pads formed at the top surface in an area array. The telecommunication system further includes a packet data network, a server communicating with the MSC and the packet data network, wherefrom a telecommunication connection is established through the packet data network and the server to the MSC. Applications of the present invention are its use in embodiments of a storage management system comprising a file system manager and a volume manager, where the placement of data into a partition may be specified by matching one or more disk region placement data attributes assigned to data with corresponding disk region attributes.