A multi-band antenna is disposed on a circuit board having a feeding line. A predetermined allowable power consumption value is defined for each module. First contact holes exposing the first patterned semiconductor layer are formed in the first dielectric layer and the gate insulator. The method further includes hard baking the first resist to the wafer and coating the first resist with a second resist. The Web service is configured to perform certain functions in response to the request, including accessing the second set of data, performing a data consistency check of the first and second sets of data, generating a response indicating a result of the data consistency check, and sending the response to the requestor via the network. The pad area is used for disposing at least one solder ball or at least one connecting pin.