An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which the thermally conductive module is mounted and through which liquid coolant is circulated. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. Information regarding the relative location of the first device, may be used to facilitate use of the first device with a processing device. The electrode has a diameter greater than about 16 French to substantially occlude the urethra. Thus, convergence of the current at the contact holes of the diffusion layer of the anode is reduced, so that the reliability of the diode element improves.