A semiconductor deposition system in accordance with the present invention includes a CMP apparatus operative to planarize an active surface of a semiconductor wafer, and a wafer cleaner for cleaning wafer after the CMP process. If the result of such comparison shows that power consumed on the primary side substantially exceeds power received on the secondary side, the system may terminate operation. Suitable base polymers include epoxies, polyurethanes, polyurethane copolymers, fluoropolymers, polyolefins and silicone rubbers. The flash ROM stores data representing features for detecting face images having inclination angles finer than those of the images of the faces having inclination angles capable of being detected by the data representing the features that have been stored in the ROM. A plurality of cooling fluid channels is integrated into the IMS. In the display apparatus and a control method thereof, the auto-adjustment function is differently implemented according to the auto-adjustment mode and the selection of the auto-adjustment button.