In general, techniques are described that facilitate the reuse of software assets within an enterprise. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. In this position, the tape portion is generally perpendicular to the urethra. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided. The invention further includes the method and system for determining the optimally-fitting viewpoint, lighting, and deformation of the located three-dimensional candidate and basing an identification of the candidate with the source on the quality of fit between projections of the candidate and the source imagery.